AI203 Ceramic Circuit Boards (MCPCB)

By applying thin deposition, lithography and electroplating processing, various metal circuit and fine trace patterns can be manufactured on the surface of ceramic substrate. Ceramic substrate consists of various superior physical properties like thin dimensions, anti-corrosive, high temperature resistant…etc.

Combining thin film lithographic processing & stable properties of ceramic, A lot of Applications can be achieved.

Image layers metal:Ti, TiW, Cu , Ni, Pd , Au , Ag, AuSn, Sn, Al…and other metallize。

Applications:Network resistor, Chip resistor, Chip resistor array, Thick-film hybrid IC, Thin-film hybrid IC, General isolator, High power LED, Solar cell, Microvave (wireless communication), Bandpass filter

Benchmark of Various Substrate Materials
Substrate Materials& Metalized Part
Compare with Thick & Thin Film Process
Real Image
Produce Method

Regulus Electronics Ltd.​

​凱元電子股份有限公司

新北市三重區光復路2段69號7樓

郵遞區號: 24158

統一編號: 24971856

7F, No.69, Sec.2, Guangfu Road, Sanchong District,

New Taipei city, Taiwan

ZIP: 24158

VAT No.24971856

TEL: +886 (2) 2760 1601

FAX: +886 (2) 2277 1827

Email: sales@reguluspec.com

Skype: sales@reguluspec.com

Web: www.reguluspec.com

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